Wave Soldering

The conveying system adopts a segmented floating structure, effectively preventing rail deformation. A newly designed titanium alloy dual-hook gripper ensures excellent anti-solder adhesion performance. Combined with a direct-coupled board loading interface and aluminum guide rails, it enables smoother and more stable PCB feeding.

The integrated modular fluxing unit is designed with a quick-connect interface to the main machine. It is equipped with newly developed precision nozzles, delivering high-efficiency and uniform atomization for consistent coating performance, fully meeting the process requirements of water-soluble flux applications.

The preheating system adopts a combination of micro hot air and far-infrared heating tubes, featuring a three-zone preheating design. With a drawer-type modular structure, it allows flexible selection of hybrid preheating modes, ensuring stable and uniform temperature distribution.

Forced natural air cooling system. (Water chiller optional)

The solder pot system is constructed with a special material and features an anti-corrosion treated inner surface. A newly designed nozzle fixation structure allows easy installation and removal. An automatic flow-guiding system facilitates solder dross collection, while the wave shape is adjustable. The solder pot temperature control accuracy is within ±2°C. Both motorized and manual options are available for solder pot in/out and lifting movements, ensuring convenient operation.

Windows 10 operating system with bilingual (Chinese/English) intelligent software. It supports parameter setting, saving and reuse, as well as remote monitoring. The system features automatic storage of process curves and data, along with temperature profile testing functionality.